Binary alloy sealing solder wire

一种二元合金密封焊料丝

  • Inventors: YAN HONG
  • Assignees: 晏弘
  • Publication Date: October 20, 2010
  • Publication Number: CN-101862922-A

Abstract

本发明公开了一种二元合金密封焊料丝,所述密封焊料丝的组分和重量百分比含量包括:银:71~73%;铜:27~29%。本发明所述密封焊料丝,可以克服现有技术中成本高、成品率低、产品的清洁性差和流散性不良、以及大批量生产时产品的一致性差等缺陷,以实现成本低、产品的清洁性和流散性优良、以及大批量生产时产品的一致性好。
The invention discloses a binary alloy sealing solder wire. The sealing solder wire consists of the following components in percentage by weight: 71 to 73 percent of silver and 27 to 29 percent of copper. The sealing solder wire can overcome the defects of the prior art, such as high cost, low yield, poor product cleanliness, poor product flowability and poor product consistency during mass production, so the sealing solder wire has the advantages of low cost, excellent product cleanliness, excellent product flowability and good product consistency during mass production.

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